Verified DDR5 DRAM Chips Direct from SK Hynix, Samsung & Micron

Our Products/services

SK Hynix A-Die DDR5 (Extreme Overclocking Chip)

Manufacturer

SK Hynix

Example IC Part Numbers:

• H5CG48MEBD-X014

• H5CG48AGBD

• H5CGD8AKBD-X021

Micron DDR5 Performance IC

Part Number

MT60B2G8HB-48B

Optimized for low-latency gaming RAM.

Samsung DDR5 B-Die / C-Die

Our approach

1

2

Understanding your sourcing challenges

Every business we work with faces its own set of pressures — whether that's navigating allocation shortages, managing lead times, or simply finding a distributor that can meet strict quality requirements. Our first step is always to sit down and understand exactly where your supply chain is struggling, so we can point you toward the right components and the right solution.

Where it all begins: silicon wafer fabrication

Before a DDR5 chip ever reaches your hands, it starts as a raw silicon wafer — typically 300mm (12 inches) in diameter — produced by manufacturers like Samsung, SK Hynix, or Micron. Using a process called photolithography, billions of transistors are etched onto the wafer surface with extraordinary precision. A single wafer can yield hundreds to thousands of individual DRAM dies, each one containing the memory cells, sense amplifiers, row/column decoders, and I/O circuitry that make modern RAM possible.

Wafer size - 300mm (12-inch)

Key manufacturers - Samsung, SK Hynix, Micron

Process - Photolithography

Data-driven procurement decisions

With a clear picture of how chips move from wafer to finished module, we help you make smarter sourcing decisions. We analyse current market pricing, availability windows, and lot verification data so you're never buying blind. Whether you're procuring chips for a single product launch or maintaining a continuous manufacturing pipeline, having accurate, up-to-date supply intelligence is what separates reactive buying from a genuine competitive advantage.

3

Wafer testing and die singulation

Once fabrication is complete, the wafer undergoes thorough defect testing before anything is cut. Only after passing quality checks does it move to the dicing stage — where either a precision saw or laser slices the wafer into individual DRAM dies. This process, known as die singulation or wafer dicing, is critical: any contamination or misalignment at this stage can render chips unusable, which is why reputable manufacturers treat it with the highest level of care.

5

Module assembly: building the DDR5 stick you install

Module manufacturers take these verified DRAM chips and assemble them onto a PCB to create the DDR5 memory sticks used in gaming systems, workstations, and servers. A typical DDR5 module uses between 8 and 16 DRAM chips per stick, with total capacities ranging from 8GB all the way up to 64GB depending on the configuration. The quality of those underlying chips — their speed grade, consistency, and traceability — directly determines the performance and reliability of the finished module.

Chips per stick (8 – 16 DRAM chips)

Capacity range (8GB → 64GB)

Standard (DDR5)

6

IC packaging: turning dies into usable chips

After singulation, each DRAM die is packaged into an integrated circuit (IC) package — the protective casing that allows the chip to be mounted onto a circuit board. This stage adds the electrical connections, physical protection, and thermal management that raw dies lack. The packaged chips are what semiconductor distributors like Apex Memory source, verify, and supply to module manufacturers around the world.

Internal components - DRAM memory cells

Sense amplifiers

Row/column decoders

I/O circuitry

4

Who We Supply

Trusted Semiconductor Supply

We maintain verified supply partnerships with leading DRAM fabs including:

• SK Hynix

• Samsung Electronics

• Micron Technology

All chips undergo strict verification and quality inspection before distribution.

Apex Memory works with businesses at every stage of the memory supply chain:

• DDR5 RAM module manufacturers

• PC and workstation system integrators

• Gaming hardware brands and enthusiast builders

• Electronics OEM manufacturers

• Semiconductor component distributors

Global Distribution Network

Our distribution network supports rapid global shipping across:

Shipping time: 48–96 hours globally

Strict Quality Control

Every DRAM chip is verified through:

• wafer origin tracking

• lot verification

• electrical performance testing

• ESD protected packaging

Only tested and certified ICs are shipped to customers.

Let us help you

Address

Av. Presidente Juscelio Kubitschek, 1909-Torre Sul, 10 andar, 0455-065, Sao Paulo, Brazil

Contacts

+55 11 95846 3995
info@apexmemory.tech